Youliang Guan

Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive

Youliang Guan, Xu Chen, Fengqin Li et al. · International Journal of Adhesion and Adhesives · 2009 · 70 citations

Materials Science, Engineering, Die Attachment +6

Analysis of cohesive failure in adhesively bonded joints with the SSPH meshless method

Cheng-Lun Tsai, Youliang Guan, Donatus Chukwubueze Ohanehi et al. · International Journal of Adhesion and Adhesives · 2014 · 45 citations

Materials Science, Structural Integrity, Engineering +7

A tapered bondline thickness double cantilever beam (DCB) specimen geometry for combinatorial fracture studies of adhesive bonds

Shantanu R. Ranade, Youliang Guan, Donatus Chukwubueze Ohanehi et al. · International Journal of Adhesion and Adhesives · 2014 · 28 citations

Materials Science, Engineering, Mechanical Behavior +9

Comparison of the performance of SSPH and MLS basis functions for two-dimensional linear elastostatics problems including quasistatic crack propagation

Cheng-Lun Tsai, Youliang Guan, R.C. Batra et al. · Computational Mechanics · 2012 · 23 citations

Numerical Analysis, Engineering, Mls Basis Functions +12

Characterizing fracture performance and the interaction of propagating cracks with locally weakened interfaces in adhesive joints

Shantanu R. Ranade, Youliang Guan, Robert B. Moore et al. · International Journal of Adhesion and Adhesives · 2017 · 23 citations

Materials Science, Damage Mechanism, Engineering +10