M.A.A. Mohd Salleh

Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles

M.A.A. Mohd Salleh, Stuart D. McDonald, C.M. Gourlay et al. · Materials & Design · 2016 · 67 citations · Full text

Materials Science, Materials Engineering, Engineering +7

Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder

Mohd Izrul Izwan Ramli, Norainiza Saud, M.A.A. Mohd Salleh et al. · Microelectronics Reliability · 2016 · 66 citations

Materials Science, Materials Engineering, Engineering +2

Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

M.A.A. Mohd Salleh, Stuart D. McDonald, Hideyuki Yasuda et al. · Scripta Materialia · 2014 · 64 citations

Materials Science, Materials Engineering, Interface Chemistry +6

The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

Mohd Izrul Izwan Ramli, M.A.A. Mohd Salleh, Hideyuki Yasuda et al. · Materials & Design · 2019 · 61 citations · Full text

Engineering, Mechanical Engineering, High Strength Solder +17

Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy

M.A.A. Mohd Salleh, Stuart D. McDonald, Yasuko Terada et al. · Materials & Design · 2015 · 47 citations · Full text

Materials Science, Alloy Design, Engineering +1