Ming He

Conduction Mechanisms of Ta/Porous SiCOH Films under Electrical Bias

Ya Ou, Pei‐I Wang, Ming He et al. · Journal of The Electrochemical Society · 2008 · 28 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Cu penetration into low-k dielectric during deposition and bias-temperature stress

Ming He, Steven W. Novak, Lakshmanan Vanamurthy et al. · Applied Physics Letters · 2010 · 24 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Kinetics of Ta ions penetration into porous low-k dielectrics under bias-temperature stress

Ming He, Ya Ou, Pei‐I Wang et al. · Applied Physics Letters · 2010 · 18 citations

Engineering, Charge Transport, Ion Process +21

Biaxially Textured Al Film Growth on CaF₂ Nanostructures toward a Method of Preparing Single-Crystalline Si Film on Glass Substrates

Huafang Li, Patrick Snow, Ming He et al. · ACS Nano · 2010 · 11 citations

Mechanism for the Formation of Isolated Poly(<i>p</i>-xylylene) Fibrous Structures under Shadowing Growth

Ming He, Pei‐I Wang, Toh‐Ming Lu · Langmuir · 2011 · 11 citations

Engineering, Mechanical Engineering, Surface Processing +21