Anthony Y.S. Sun

Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

W.H. Zhu, Luhua Xu, J.H.L. Pang et al. · 2008 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +16

Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints

F. X., J.H.L. Pang, Wenhui Zhu et al. · 2006 · 42 citations

Natural Sciences, Materials Engineering, Materials Science +17

Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement

Wenhui Zhu, Guang Li, Wei Sun et al. · 2007 · 36 citations

Pharmacy, Materials Engineering, Materials Science +13

Comprehensive Modeling of Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition

J.H.L. Pang, W.H. Zhu, Wei Sun et al. · 2007 · 26 citations

Engineering, Materials Engineering, Materials Science +17

Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages

Wei Sun, Wenhui Zhu, Retuta Danny et al. · 2007 · 23 citations

Engineering, Materials Engineering, Materials Science +13