Wei Sun - Concepedia

Author

Wei Sun

Hong Kong Polytechnic University

Also Known As

Wei Guo Sun, Wei Sun

Publications

511

Citations

H-Index

Concepts

All Affiliations

Hong Kong Polytechnic University Nanyang Technological University Sichuan University

About

Wei Sun is an author at Hong Kong Polytechnic University specializing in mechanical engineering, engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	256
2	Civil Engineering	3	3	124
3	Computer Engineering	2	2	25
4	Electrical Engineering	2	2	36
5	Construction Engineering	1	1	35

Wei Sun

Publications

448

Citations

H-Index

Page 1

	Year	Citations
Bamboo flattening technique: a literature and patent review Zhichao Lou, Qiuyi Wang, Wei Sun, European Journal of Wood and Wood Products Bamboo Flattening TechniqueIndustrial DesignMechanical EngineeringWood FibreWood Technology	2021	137
Improvement of Mechanical Properties in Polypropylene‐ and Glass‐Fibre‐Reinforced Peach Shell Lightweight Concrete Fan Wu, Changwu Liu, Zhaofeng Diao, Advances in Materials Science and Engineering Materials ScienceFiber ReinforcementReinforcement MaterialEngineeringMechanical Properties	2018	59
Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints F. X., J.H.L. Pang, Wenhui Zhu, EngineeringMechanical EngineeringCyclic BendingReliability EngineeringStressstrain Analysis	2006	41
Effect of peach shell as lightweight aggregate on mechanics and creep properties of concrete Fan Wu, Changwu Liu, Wei Sun, European Journal of Environmental and Civil engineering Creep StrainLightweight AggregateEngineeringCement ManufactureMechanical Engineering	2019	35
Mechanical and Creep Properties of Concrete containing Apricot Shell Lightweight Aggregate Fan Wu, Changwu Liu, Wei Sun, KSCE Journal of Civil Engineering Materials ScienceEngineeringMechanical EngineeringConcrete TechnologyReinforced Concrete	2019	30
Comprehensive Modeling of Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition J.H.L. Pang, W.H. Zhu, Wei Sun, EngineeringDrop PerformanceMechanical EngineeringMiniature Handheld ProductsResidual Stress	2007	26
Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages Wei Sun, Wenhui Zhu, Retuta Danny, EngineeringIndustrial EngineeringDifferent Qfn PackagesMechanical EngineeringSolder Pad	2007	23
Simulation study on the warpage behavior and board-level temperature cycling reliability of PoP potentially for high-speed memory packaging Wei Sun, Wenhui Zhu, Kriangsak Sae Le,	2008	23
PZT‐Based Detection of Compactness of Concrete in Concrete Filled Steel Tube Using Time Reversal Method Shi Yan, Jinzhi Fu, Wei Sun, Mathematical Problems in Engineering	2014	22
Ultra-thin Die Characterization for Stack-die Packaging Wei Sun, Wh Zhu, Franklin Che, Ultra-thin Die CharacterizationEngineeringMechanical EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2007	17

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