W.H. Zhu

Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

W.H. Zhu, Luhua Xu, J.H.L. Pang et al. · 2008 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +16

Comprehensive Modeling of Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition

J.H.L. Pang, W.H. Zhu, Wei Sun et al. · 2007 · 26 citations

Engineering, Materials Engineering, Materials Science +17

Development and Assessment of Global-Local Modeling Technique Used in Advanced Microelectronic Packaging

J.H.L. Pang, W.H. Zhu, Wei Sun et al. · 2007 · 13 citations

Engineering, Mechanical Engineering, Finite Element Analysis +11

Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact

Zhen Liu, Mingang Fang, Lei Shi et al. · Micromachines · 2022 · 10 citations · Full text

Engineering, Materials Engineering, Materials Science +17