Sahana Swarup

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

Zao Liu, Sahana Swarup, Sheldon X.-D. Tan et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2014 · 64 citations

Engineering, Thermal Issue, 3-D Stacked Ics +18

A Power-Driven Thermal Sensor Placement Algorithm for Dynamic Thermal Management

Hai Wang, Sheldon X.-D. Tan, Sahana Swarup et al. · Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013 · 2013 · 16 citations

Engineering, Energy Efficiency, Power Optimization (Eda) +22

Thermal characterization of TSV based 3D stacked ICs

Sahana Swarup, Sheldon X.-D. Tan, Zao Liu · 2012 · 15 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +15

Compact lateral thermal resistance modeling and characterization for TSV and TSV array

Zao Liu, Sahana Swarup, Sheldon X.-D. Tan · 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) · 2013 · 12 citations

Engineering, Tsv Array, Thermal Conductivity +16

Compact nonlinear thermal modeling of packaged integrated systems

Zao Liu, Sheldon X.-D. Tan, Hai Wang et al. · 2013 · 10 citations

Engineering, Subspace Identification Method, Power Electronics +17