Ji Xiong is an author at Beihang University specializing in electronic packaging, mechanical engineering, and solid mechanics.
Top concepts
EngineeringHeat TransferSolid MechanicsMaterial ScienceThermal EngineeringElectronic PackagingMechanical EngineeringMechanics Of Materials
Publications per year
2011–2011
1
1
On thermo-mechanical reliability of plated-through-hole (PTH)
Fei Su, Ronghai Mao, Ji Xiong et al. · Microelectronics Reliability · 2011 · 34 citations
Materials Science, Thermo-mechanical Reliability, Engineering +9
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