T. M. Tsai

Effective repair to ultra-low-<i>k</i> dielectric material (<i>k</i>∼2.0) by hexamethyldisilazane treatment

Y. S. Mor, Ting‐Chang Chang, Po‐Tsun Liu et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +17

Recovering Dielectric Loss of Low Dielectric Constant Organic Siloxane during the Photoresist Removal Process

Ting‐Chang Chang, Y. S. Mor, Po‐Tsun Liu et al. · Journal of The Electrochemical Society · 2002 · 42 citations

Natural Sciences, Chemistry, Materials Science +17

Eliminating dielectric degradation of low-<i>k</i> organosilicate glass by trimethylchlorosilane treatment

Ting‐Chang Chang, Po‐Tsun Liu, Y. S. Mor et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +10

Investigation of the electrical properties and reliability of amorphous SiCN

C. W. Chen, Tien‐Chun Chang, Po‐Tsun Liu et al. · Thin Solid Films · 2003 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +14

Enhancing the resistance of low-k hydrogen silsesquioxane (HSQ) to wet stripper damage

Tien‐Chun Chang, Y. S. Mor, Po‐Tsun Liu et al. · Thin Solid Films · 2001 · 24 citations

Natural Sciences, Chemistry, Materials Science +6