Concepedia

Melida Chin

MC

Statistics

Publications

6

Citations

151

H-Index

6

Active since

2004

Affiliations

University of Michigan(Current)

Melida Chin is an author at University of Michigan specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringElectrical InsulationMechanicsMaterial ScienceMechanics Of MaterialsMicroelectronicsMicrofabricationFlexible Electronics

Publications per year

2004–2010

6

Publications

6

Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesive Assemblies

Melida Chin, Kaushik A. Iyer, S. Jack Hu · IEEE Transactions on Components and Packaging Technologies · 2004 · 63 citations

Engineering, Assembly Method, Mechanical Engineering +19

A study on the mechanical properties for developing a computer simulation model for heat treatment process

K.O. Lee, Jungchul Kim, Melida Chin et al. · Journal of Materials Processing Technology · 2006 · 25 citations

Mathematical Modeling, Engineering, Mechanical Properties +15

Effect of elastic recovery on the electrical contact resistance in anisotropic conductive adhesive assemblies

Melida Chin, J. R. Barber, Siqing Hu · IEEE Transactions on Components and Packaging Technologies · 2006 · 19 citations

Materials Science, Engineering, Specific Resistance +15

Product-Oriented Sensitivity Analysis for Multistation Compliant Assemblies

Jianpeng Yue, Jaime A. Camelio, Melida Chin et al. · Journal of Mechanical Design · 2006 · 18 citations

Engineering, Industrial Engineering, Mechanical Engineering +22

A Multiple Particle Model for the Prediction of Electrical Contact Resistance in Anisotropic Conductive Adhesive Assemblies

Melida Chin, S. Jack Hu · IEEE Transactions on Components and Packaging Technologies · 2007 · 15 citations

Engineering, Mechanical Engineering, Anisotropic Conductive Adhesive +17

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