Concepedia

Kiyoharu Mori

KM

1

Publications

13

Citations

1

H-Index

2019

Active since

Kiyoharu Mori is an author specializing in advanced packaging, microelectronics, and integrated circuits.

Top concepts

3D PrintingEngineeringApplied PhysicsSurface ScienceMaterial ScienceMicroelectronicsAdvanced PackagingIntegrated CircuitsElectronic PackagingElectrical Engineering

Publications per year

2019–2019

1

Publications

1

Fully-Filled, Highly-Reliable Fine-Pitch Interposers with TSV Aspect Ratio >10 for Future 3D-LSI/IC Packaging

Murugesan Murugesan, Takafumi Fukushima, Kiyoharu Mori et al. · 2019 · 13 citations

Electrical Resistance, Engineering, Integrated Circuits +21

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