S. Wada

120-Gb/s multiplexing and 110-Gb/s demultiplexing ICs

Yoshishige Suzuki, Z. Yamazaki, Y. Amamiya et al. · IEEE Journal of Solid-State Circuits · 2004 · 51 citations

System On Chip, Electrical Engineering, Engineering +14

Fabrication of three-dimensional IC using `cumulatively bonded IC' (CUBIC) technology

Y. Hayashi, S. Wada, K. Kajiyana et al. · 1990 · 26 citations

Engineering, Integrated Circuits, Cubic Technology +19

A new three dimensional IC fabrication technology, stacking thin film DUAL-CMOS layers

Y. Hayashi, K. Oyama, Shuji Takahashi et al. · 1991 · 21 citations

Engineering, Novel 3-D Ic, Integrated Circuits +20

40-Gb/s optical receiver IC chipset - including a transimpedance amplifier, a differential amplifier, and a decision circuit - using GaAs-based HBT technology

Y. Amamiya, Yoshishige Suzuki, M. Kawanaka et al. · 2003 · 20 citations

Free-space Optical Network, Photonics, Optical Materials +14

110Gb/s multiplexing and demultiplexing ICs

Yoshishige Suzuki, Y. Arnamiya, Z. Yamazaki et al. · 2004 · 14 citations

System On Chip, Electrical Engineering, Engineering +11