Muhammad Hassan Malik

Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives

Muhammad Hassan Malik, Giovanna Grosso, Hubert Zangl et al. · Microelectronics Reliability · 2021 · 41 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Optimizing Carbon Structures in Laser-Induced Graphene Electrodes Using Design of Experiments for Enhanced Electrochemical Sensing Characteristics

Fabiane Fantinelli Franco, Muhammad Hassan Malik, Libu Manjakkal et al. · ACS Applied Materials & Interfaces · 2024 · 22 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Future Thread: Printing Electronics on Fibers

Manoj Jose, Emily Bezerra Alexandre, Lukas Neumaier et al. · ACS Applied Materials & Interfaces · 2024 · 12 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl et al. · Electronics · 2022 · 11 citations · Full text

Engineering, Materials Engineering, Materials Science +17