Concepedia
2
Publications
24
Citations
H-Index
2023
Active since
Affiliations
National Tsing Hua University(Current)
Che-Pei Chang is an author at National Tsing Hua University.
Publications per year
2023–2023
Warpage Estimation and Demonstration of Panel-Level Fan-Out Packaging With Cu Pillars Applied on a Highly Integrated Architecture
Chang‐Chun Lee, Che-Pei Chang, Chin‐Yi Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2023 · 13 citations
Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration
Chang‐Chun Lee, Che-Pei Chang, Pei‐Chen Huang · IEEE Transactions on Components Packaging and Manufacturing Technology · 2023 · 11 citations
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