Yasuhiro Yamaji

IMC study on Cu wirebond failures under high humidity conditions

Yasuhiro Yamaji, Masahiko Hori, Hirokazu Ikenosako et al. · 2011 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +17

Characteristics of Nonylphenol Polyethoxylate-Degrading Bacteria Isolated from Coastal Sediments

Toshimichi Maeda, Kazuhide Hayakawa, Mu You et al. · Microbes and Environments · 2005 · 12 citations · Full text

Life Sciences, Microbiology, Molecular Biology +15

Interconnection of Micropad Electrodes by Controlled “Extraneous” Deposition of Electroless NiB Film

Tokihiko Yokoshima, Yasuhiro Yamaji, Hirotaka Oosato et al. · Electrochemical and Solid-State Letters · 2007 · 11 citations

Engineering, Materials Engineering, Materials Science +17

A novel Wafer level Fan-out Package (WFOP™) applicable to 50um pad pitch interconnects

Naoki Hayashi, Tomoko Takahashi, Nobuaki Shintani et al. · 2011 · 10 citations

Engineering, Electrical Engineering, Electronic Materials +16