C. Melton

The effect of reflow process variables on the wettability of lead-free solders

C. Melton · JOM · 1993 · 59 citations

Engineering, Materials Engineering, Materials Science +5

Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly

Daniel Gamota, C. Melton · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1998 · 22 citations

Engineering, Materials Engineering, Materials Science +15

Advanced encapsulant materials systems for flip-chip-on-board assemblies. I. Encapsulant materials with improved manufacturing properties. II. Materials to integrate the reflow and underfilling processes

Daniel Gamota, C. Melton · 2002 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +15

A Study of the Effects of the Accelerated Reader Program on Fifth Grade Students' Reading Achievement Growth

C. Melton, Bobbie C. Smothers, Eugene Anderson et al. · Reading improvement · 2004 · 19 citations

Education, Instruction, Literacy Education +16

The development of reflowable materials systems to integrate the reflow and underfill dispensing processes for DCA/FCOB assembly

Daniel Gamota, C. Melton · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1997 · 19 citations

Engineering, Materials Engineering, Materials Science +13