Karl-F. Becker

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Active since

2018

Affiliations

Infineon Technologies (Germany)(Current)

Fraunhofer Institute for Reliability and Microintegration

Technische Universität Berlin

Karl-F. Becker is an author at Infineon Technologies (Germany) specializing in fan-out wafer-level packaging, manufacturing engineering, and additive manufacturing.

Publications per year

2018–2020

Publications

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Ali Roshanghias, Marc Dreissigacker, Christina Scherf et al. · Micromachines · 2020 · 17 citations · Full text

Engineering, Manufacturing Engineering, Mechanical Engineering +17

The Realization of Redistribution Layers for FOWLP by Inkjet Printing

Ali Roshanghias, Ying Ma, Marc Dreissigacker et al. · 2018 · 11 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +10

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