Concepedia

Jack Lin

JL

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Publications

1

Citations

13

H-Index

1

Active since

2011

Affiliations

United Microelectronics (Taiwan)(Current)

Jack Lin is an author at United Microelectronics (Taiwan) specializing in materials engineering, electrical engineering, and electronic packaging.

Top concepts

Publications per year

2011–2011

1

Publications

1

Effects of Cu surface roughness on TDDB for direct polishing ultra-low k dielectric Cu interconnects at 40nm technology node and beyond

Wen‐Chin Lin, Jack Lin, T.C. Tsai et al. · Microelectronic Engineering · 2011 · 13 citations

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