Robert M. Charatan

Low Temperature Deposition of TiN Using Tetrakis(dimethylamido)‐Titanium in an Electron Cyclotron Resonance Plasma Process

A. Weber, R. Nikulski, C.‐P. Klages et al. · Journal of The Electrochemical Society · 1994 · 27 citations

Initial stages of metal/semiconductor interface formation: Au and Ag on Si(111)

R. Stanley Williams, Richard S. Daley, Judy H. Huang et al. · Applied Surface Science · 1990 · 22 citations

Materials Science, Engineering, Metal/semiconductor Interface Formation +7

Aspects of TiN and Ti deposition in an ECR plasma enhanced CVD process

A. Weber, R. Nikulski, C.‐P. Klages et al. · Applied Surface Science · 1995 · 22 citations

Materials Science, Engineering, Applied Physics +8

An investigation of the Si(111)−(√3 × √3)R30°−Ag surface by Li+ impact collision ion scattering spectroscopy

Richard S. Daley, Robert M. Charatan, R. Stanley Williams · Surface Science · 1990 · 22 citations

Materials Science, Surface Characterization, Engineering +7

Formation Mechanism of TiN by Reaction of Tetrakis(dimethylamido)‐Titanium with Plasma‐Activated Nitrogen

A. Weber, C.‐P. Klages, M. E. Gross et al. · Journal of The Electrochemical Society · 1995 · 20 citations