H. T.

Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints

Mingliang Huang, Yuting Huang, H. T. et al. · Journal of Electronic Materials · 2010 · 38 citations

Materials Engineering, Materials Science, Electrochemical Corrosion Behavior +5

Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Yi Zhong, Ning Zhao, C. Y. Liu et al. · Applied Physics Letters · 2017 · 34 citations · Full text

Engineering, Crystal Growth Technology, Interconnect (Integrated Circuits) +23

Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect

Ning Zhao, Yi Zhong, Wei Dong et al. · Applied Physics Letters · 2017 · 30 citations

Engineering, Preferred Orientation, Interconnect (Integrated Circuits) +16

Description of the Hypo-peritectic Steel Solidification under Continuous Cooling and Crack Susceptibility

José Jorge Ruíz Mondragón, M. Herrera–Trejo, Manuel Castro-Román et al. · ISIJ International · 2008 · 20 citations · Full text

Engineering, Mechanical Engineering, Solidification Mode +16

Effect of Mechanical Loading on the Oxidation Kinetics and Oxide-Scale Failure of Pure Ni

Changhai Zhou, H. T., L. Wang · Oxidation of Metals · 2008 · 16 citations

Materials Science, Materials Engineering, Pure Ni +10