K. Takahashi is an author at Toshiba (Japan) specializing in computer engineering, 3d integration, and microfabrication.
Top concepts
Engineering3D IntegrationMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingComputer ArchitectureEducationTechnology3D Printing
Publications per year
2006–2009
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Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)
Hiroshi Yoshikawa, A. Kawasaki, Tomoaki et al. · 2009 · 55 citations
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