Cheonman Shim

Significant improvement of electrical and thermal properties of low dielectric constant plasma polymerized paraxylene thin films by postdeposition H2+He plasma treatment

Yong Chun Quan, Sanghak Yeo, Cheonman Shim et al. · Journal of Applied Physics · 2001 · 12 citations · Full text

Engineering, Plasma Treatment Time, Significant Improvement +16

Plasma Enhanced CVD of Low Dielectric Constant Plasma Polymerized Decahydronaphthalene Thin Films

Jae-Hyun Yang, Cheonman Shim, Donggeun Jung · Chemical Vapor Deposition · 2002 · 12 citations

Engineering, Organic Electronics, Low Dielectric Constant +17

Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects

Seol-Min Yi, Cheonman Shim, Han-Choon Lee et al. · Microelectronic Engineering · 2007 · 11 citations

Materials Science, Materials Engineering, Engineering +10

Relationship between C=C Bonds and Mechanical Properties of Carbon Rich Low-k Films deposited by Plasma Enhanced Chemical Vapor Deposition

Cheonman Shim, Donggeun Jung · Japanese Journal of Applied Physics · 2004 · 10 citations

Materials Science, Materials Engineering, Engineering +14

Characteristics under Bias-Temperature-Stress of Cu/Low-k a-SiCO:H Structures Prepared by Plasma Enhanced Chemical Vapor Deposition Using a Hexamethyldisilane Precursor and Cu Sputtering

Cheonman Shim, Jaeyoung Yang, Munkyu Choi et al. · Japanese Journal of Applied Physics · 2003 · 10 citations

Cu Films, Engineering, Thin Film Process Technology +20