A.Y. Kuo

A new criterion for package integrity under solder reflow conditions

Luu Nguyen, K.L. Chen, J.A. Schaefer et al. · 2002 · 41 citations

Engineering, Mechanical Engineering, Verification +16

Transient Stress Intensity Factors of an Interfacial Crack Between Two Dissimilar Anisotropic Half-Spaces, Part 1: Orthotropic Materials

A.Y. Kuo · Journal of Applied Mechanics · 1984 · 36 citations

Engineering, Mechanical Engineering, Orthotropic Materials +18

Transient Stress Intensity Factors of an Interfacial Crack Between Two Dissimilar Anisotropic Half-Spaces, Part 2: Fully Anisotropic Materials

A.Y. Kuo · Journal of Applied Mechanics · 1984 · 28 citations

Engineering, Fracture Optimization, Mechanical Engineering +23

Popcorning-a fracture mechanics approach

A.Y. Kuo, W.T. Chen, Luu Nguyen et al. · 2002 · 14 citations

Materials Science, Engineering, Durability Performance +14

Evaluation of plastic package delamination via reliability testing and fracture mechanics approach

V. Holalkere, S. Mirano, A.Y. Kuo et al. · 2002 · 13 citations

Material Delamination, Fibre-reinforced Plastic, Reliability Engineering +15