Concepedia

Shinya Takyu

ST

Statistics

Publications

3

Citations

67

H-Index

3

Active since

2006

Affiliations

Toshiba (Japan)(Current)

Shinya Takyu is an author at Toshiba (Japan) specializing in microelectronics, electronic packaging, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingApplied PhysicsMicrofabrication3D PrintingMemory DevicesMicrostructureIndustrial DesignMicromanufacturing

Publications per year

2006–2016

3

Publications

3

A study on chip thinning process for ultra thin memory devices

Shinya Takyu, Junya Sagara, Tetsuya Kurosawa · 2008 · 37 citations

Non-volatile Memory, Engineering, Mechanical Engineering +23

A Novel Dicing Technologies for WLCSP Using Stealth Dicing through Dicing Tape and Back Side Protection-Film

Shinya Takyu, Yusuke Fumita, Daisuke Yamamoto et al. · 2016 · 16 citations

Industrial Design, Package Crack, Chip-scale Package +14

Novel Wafer Dicing and Chip Thinning Technologies Realizing High Chip Strength

Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu et al. · MRS Proceedings · 2006 · 14 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +8

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