Y. Li

Chemical–mechanical polishing of copper and tantalum with silica abrasives

Y. Li, M. Hariharaputhiran, S. V. Babu · Journal of materials research/Pratt's guide to venture capital sources · 2001 · 66 citations

Materials Engineering, Materials Science, Chemical Engineering +6

Effect of pH and H[sub 2]O[sub 2] on Ta Chemical Mechanical Planarization

S. C. Kuiry, Sudipta Seal, W. Fei et al. · Journal of The Electrochemical Society · 2002 · 61 citations

Materials Science, Chemical Engineering, Engineering +14

Electrical properties of superfilled sub-micrometer silver metallizations

D. Josell, Craig D. Burkhard, Y. Li et al. · Journal of Applied Physics · 2004 · 61 citations

Engineering, Metallic Nanomaterials, Electrical Properties +19

Investigation of Copper Removal Mechanisms during CMP

Guo-Feng Xu, Hong Liang, Joe R. Zhao et al. · Journal of The Electrochemical Society · 2004 · 56 citations · Full text

Engineering, Cu Cmp, Mechanical Engineering +17

Controlling the Size of Vesicles Prepared from Egg Lecithin using a Hydrotrope

Nicole Heldt, Jiawen Zhao, Stig E. Friberg et al. · Tetrahedron · 2000 · 21 citations

Egg Lecithin, Vesicle Biology, Medicine +3