Statistics
Publications
1
Citations
46
H-Index
1
Active since
2014
Affiliations
Broadcom (United States)(Current)
Henry Sze is an author at Broadcom (United States) specializing in ball grid array packaging, packaging design, and underfill materials.
Publications per year
2014–2014
1
1
Material characterization of a novel lead-free solder material — SACQ
Tak-Sang Yeung, Henry Sze, Keith Tan et al. · 2014 · 46 citations
1–1 of 1