Statistics
Publications
1
Citations
46
H-Index
1
Active since
2014
Affiliations
Broadcom (United States)(Current)
Tak-Sang Yeung is an author at Broadcom (United States) specializing in wafer-level packaging, ball grid array packaging, and device reliability.
Publications per year
2014–2014
1
1
Material characterization of a novel lead-free solder material — SACQ
Tak-Sang Yeung, Henry Sze, Keith Tan et al. · 2014 · 46 citations
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