Hidenori Abe

Cu wire and Pd-Cu wire package reliability and molding compounds

Hidenori Abe, Dong Chul Kang, Takashi Yamamoto et al. · 2012 · 60 citations

Advanced Packaging, Materials Engineering, Electrical Engineering +14

NCF for pre-applied process in higher density electronic package including 3D-package

Kazutaka Honda, Akira Nagai, Makoto Satou et al. · 2012 · 32 citations

Engineering, Mechanical Engineering, Pre-applied Process +16

Dissolved organic matter in colored water from mountain bog pools in Japan II. Biological decomposability

Yasuhiro Satoh, Hidenori Abe · Archiv für Hydrobiologie · 1987 · 21 citations

Bioconcentration, Environmental Chemistry, Hydrobiology +5

Molded reliability study for different Cu wire bonding configurations

Ivy Qin, Hui Xu, Basil Milton et al. · 2013 · 17 citations

Materials Science, Materials Engineering, Reliability +15

Wafer level compression molding compounds

Taku Hasegawa, Hidenori Abe, Takatoshi Ikeuchi · 2012 · 16 citations

Materials Engineering, Materials Science, Advanced Packaging +12