Tzong-Sheng Chang

Ultra high density 3D via RRAM in pure 28nm CMOS process

Min-Che Hsieh, Yu‐Cheng Liao, Y. L. Chin et al. · 2013 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +17

Point twin-bit RRAM in 3D interweaved cross-point array by Cu BEOL process

Y. L. Chin, Shu-En Chen, Min-Che Hsieh et al. · 2014 · 23 citations

Engineering, Computer Engineering, Electronic Materials +12

Thermal stability study of TiN/TiSi2 diffusion barrier between Cu and <i>n</i>+Si

Tzong-Sheng Chang, Wenchun Wang, Lih-Ping Wang et al. · Journal of Applied Physics · 1994 · 23 citations

Engineering, Materials Engineering, Materials Science +17

A new saw-like self-recovery of interface states in nitride-based memory cell

Yuh-Te Sung, Po‐Yen Lin, Jim Chen et al. · 2014 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +17

A New High-Density Twin-Gate Isolation One-Time Programmable Memory Cell in Pure 28-nm CMOS Logic Process

Woan Yun Hsiao, Ping Chun Peng, Tzong-Sheng Chang et al. · IEEE Transactions on Electron Devices · 2014 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +11