Concepedia
Statistics
Publications
6
Citations
69
H-Index
Active since
2006
Affiliations
Infineon Technologies (Singapore)(Current)
Nanyang Technological University
Singapore Science Park
Institute of Microelectronics
Agency for Science, Technology and Research
Alfred Yeo is an author at Infineon Technologies (Singapore) specializing in engineering, materials science, and mechanical engineering.
Top concepts
EngineeringMaterial ScienceMechanical EngineeringElectronic PackagingMechanics Of MaterialsStructural MechanicsMechanicsThin Films3D PrintingSolid Mechanics
Publications per year
2006–2017
Characterization of interfacial delamination in multi-layered integrated circuit packaging
Pamela Lin, Fei Shen, Alfred Yeo et al. · Surface and Coatings Technology · 2016 · 14 citations
Materials Science, Engineering, Advanced Packaging (Semiconductors) +5
Indentation damage evaluation on metal-coated thin-films stacked structure
Alfred Yeo, Kun Zhou · Journal of materials research/Pratt's guide to venture capital sources · 2015 · 12 citations · Full text
Materials Engineering, Materials Science, Engineering +4
Study on damage and fracture of thin-film stacked structures through indentation test with acoustic emission sensing
Alfred Yeo, Kai Yang, Fa Xing et al. · International Journal of Mechanical Sciences · 2017 · 12 citations
Materials Science, Thin-film Stacked Structures, Damage Mechanism +9
Impact of Mold Compound Cure Shrinkage on Substrate Block Warpage Simulation
Mayhuan Lim, Chua Li Yean, Alfred Yeo et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 2006 · 11 citations
Materials Science, Leadless Leadframe Substrates, Leadless Leadframe +12
Consideration of temperature and current stress testing on flip chip solder interconnects
Alfred Yeo, B. Ebersberger, Charles Lee · Microelectronics Reliability · 2008 · 10 citations
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