Bingzhi Su

Design and modeling of RF MEMS tunable capacitors using electro-thermal actuators

Zhiping Feng, Wenge Zhang, Bingzhi Su et al. · 2003 · 76 citations

Electrical Engineering, Mems Tunable Capacitor, Engineering +12

RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill

Zhiping Feng, Wemge Zhang, Bingzhi Su et al. · IEEE Transactions on Microwave Theory and Techniques · 1998 · 58 citations

Engineering, Mechanical Characterization, Interconnect (Integrated Circuits) +17

The realization and design considerations of a flip-chip integrated MEMS tunable capacitor

Kevin Harsh, Bingzhi Su, Wenge Zhang et al. · Sensors and Actuators A Physical · 2000 · 54 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +6

RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill

Zhiping Feng, Wenge Zhang, Bingzhi Su et al. · 2002 · 52 citations

Engineering, Mechanical Characterization, Interconnect (Integrated Circuits) +18

The effect of underfill epoxy on warpage in flip-chip assemblies

Wenge Zhang, Derick Wu, Bingzhi Su et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 44 citations

Engineering, Mechanical Engineering, Simulated Tri-layered Assembly +19