Concepedia

Derick Wu

DW

1

Publications

44

Citations

1

H-Index

1998

Active since

Affiliations

University of Colorado Boulder(Current)

Derick Wu is an author at University of Colorado Boulder specializing in electronic packaging, materials science, and materials engineering.

Top concepts

EngineeringMicrostructureApplied PhysicsSolid MechanicsMaterial ScienceMicrofabricationElectronic PackagingMaterials EngineeringMechanical PropertiesMechanical Engineering

Publications per year

1998–1998

1

Publications

1

The effect of underfill epoxy on warpage in flip-chip assemblies

Wenge Zhang, Derick Wu, Bingzhi Su et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 44 citations

Engineering, Mechanical Engineering, Simulated Tri-layered Assembly +19

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