Hushan Cui

CMOS Scaling for the 5 nm Node and Beyond: Device, Process and Technology

Henry H. Radamson, Yuanhao Miao, Ziwei Zhou et al. · Nanomaterials · 2024 · 105 citations · Full text

Engineering, Electrical Engineering, Microelectronics +16

The Challenges of Advanced CMOS Process from 2D to 3D

Henry H. Radamson, Yanbo Zhang, Xiaobin He et al. · Applied Sciences · 2017 · 84 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Investigation of the interface between LPCVD-SiNx gate dielectric and III-nitride for AlGaN/GaN MIS-HEMTs

Zhaoyang Liu, Sen Huang, Qilong Bao et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2016 · 46 citations

Engineering, Electrical Engineering, Materials Science +17

Investigation of TiAlC by Atomic Layer Deposition as N Type Work Function Metal for FinFET

Jinjuan Xiang, Tingting Li, Yanbo Zhang et al. · ECS Journal of Solid State Science and Technology · 2015 · 34 citations · Full text

Engineering, Materials Engineering, Materials Science +17

In-memory direct processing based on nanoscale perpendicular magnetic tunnel junctions

Kaihua Cao, Wenlong Cai, Yizheng Liu et al. · Nanoscale · 2018 · 32 citations

Engineering, Electrical Engineering, Materials Engineering +14