Statistics
Publications
5
Citations
90
H-Index
5
Active since
1995
Affiliations
Shinya Nakamura is an author at Hitachi (Japan) specializing in materials science, natural sciences, and materials engineering.
Publications per year
1995–2019
5
5
Molded reliability study for different Cu wire bonding configurations
Ivy Qin, Hui Xu, Basil Milton et al. · 2013 · 17 citations
Natural Sciences, Materials Engineering, Materials Science +12
Process optimization and reliability study for Cu wire bonding advanced nodes
Ivy Qin, Hui Xu, Basil Milton et al. · 2014 · 12 citations
Natural Sciences, Materials Engineering, Materials Science +14
1–5 of 5