Ren Jialie

Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

Jianfeng Yan, Jianfeng Yan, Guisheng Zou et al. · Scripta Materialia · 2012 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +14

Characteristics and formation mechanism of porosities in CFRP during laser joining of CFRP and steel

Xianghu Tan, Jing Zhang, Jiguo Shan et al. · Composites Part B Engineering · 2014 · 182 citations

Engineering, Materials Engineering, Materials Science +10

Formation process of the bonding joint in Ti/Al diffusion bonding

Yao Wei, Wu Aiping, Zou Guisheng et al. · Materials Science and Engineering A · 2007 · 154 citations

Engineering, Materials Engineering, Materials Science +12

Low Temperature Bonding of Cu Metal through Sintering of Ag Nanoparticles for High Temperature Electronic Application

Guisheng Zou, Jianfeng Yan, Fengwen Mu et al. · The Open Surface Science Journal · 2010 · 62 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

Jianfeng Yan, Guisheng Zou, Aiping Wu et al. · Journal of Electronic Materials · 2012 · 44 citations

Natural Sciences, Materials Engineering, Materials Science +8