Chung-Sheng Wu

DSC and FTIR analysis of the curing behaviors of epoxy/DICY/solvent open systems

Shinn‐Gwo Hong, Chung-Sheng Wu · Thermochimica Acta · 1998 · 94 citations

Materials Science, Ftir Analysis, Engineering +9

Carrier transport across heterojunction interfaces

Chung-Sheng Wu, E.S. Yang · Solid-State Electronics · 1979 · 84 citations

Engineering, Physics, Applied Physics +4

Current suppression induced by conduction-band discontinuity in Al0.35Ga0.65As-GaAs <i>N</i>-<i>p</i> heterojunction diodes

Chung-Sheng Wu, E.S. Yang · Journal of Applied Physics · 1980 · 32 citations

Semiconductors, Semiconductor Technology, Electrical Engineering +9

Physical basis of scattering potential at grain boundary of polycrystalline semiconductors

Chung-Sheng Wu, E.S. Yang · Applied Physics Letters · 1982 · 27 citations

Attenuation Factor, Engineering, Charge Transport +18

Grain boundary effects on the electrical behavior of Al-poly-Si Schottky-barrier solar cells

Chung-Sheng Wu, E.S. Yang, Wei Hwang et al. · IEEE Transactions on Electron Devices · 1980 · 22 citations

Engineering, Photovoltaics, Semiconductor Device +18