Highly efficient and selective extraction of gold by reduced graphene oxide

Fei Li, Jiuyi Zhu, Pengzhan Sun, +8

Nature Communications

Viscous Solvent-Assisted Planetary Ball Milling for the Scalable Production of Large Ultrathin Two-Dimensional Materials

Yicong Zhou, Lanshu Xu, Minsu Liu, +9

ACS Nano

A Malleable Composite Dough with Well-Dispersed and High-Content Boron Nitride Nanosheets

Lanshu Xu, Ke Zhan, Siyuan Ding, +10

ACS Nano

NanosheetEngineeringCubic Boron NitrideMechanical EngineeringNanostructured Polymer +16

Near-room-temperature water-mediated densification of bulk van der Waals materials from their nanosheets

Jiuyi Zhu, Fei Li, YuanZhen Hou, +10

Nature Materials

Materials ScienceNanosheetEngineeringNanoporous MaterialNanoscale Chemistry +6

Gas-phase synthesis of Ti2CCl2 enables an efficient catalyst for lithium-sulfur batteries

Maoqiao Xiang, Zihan Shen, Jie Zheng, +15

The Innovation

Exfoliation of MoS₂ and h-BN nanosheets by hydrolysis of LiBH₄

Jiuyi Zhu, Hui Wang, Jiangwen Liu, +2

Nanotechnology

Ultrahigh Mass Activity for the Hydrogen Evolution Reaction by Anchoring Platinum Single Atoms on Active {100} Facets of TiC via Cation Defect Engineering

Qinghua Dong, Sugang Ma, Jiuyi Zhu, +8

Advanced Functional Materials

Materials ScienceChemical EngineeringEngineeringPt Utilization EfficiencyHydrogen Transition +13

Reaction Route Optimized LiBH₄ for High Reversible Capacity Hydrogen Storage by Tunable Surface-Modified AlN

Jiuyi Zhu, Yuchen Mao, Hui Wang, +3

ACS Applied Energy Materials

Drying ProcessHydrogen Energy TechnologyHydrogen ProductionEngineeringChemistry +17

The milled LiBH 4 / h- BN composites exhibiting unexpected hydrogen storage kinetics and reversibility

Jiuyi Zhu, Hui Wang, Weitong Cai, +3

International Journal of Hydrogen Energy

Materials ScienceMaterials EngineeringHydrogen Energy TechnologyEngineeringEnergy Storage +4

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

Krishna Darbha, J. H. Okura, Santosh Shetty, +4

Journal of Electronic Packaging

EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Fcob AssembliesFlip Chip +17