Paul Fortier

A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2016 · 94 citations

Engineering, Electrical Engineering, Microfabrication +16

Integrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing

Tymon Barwicz, Bo Peng, Robert Leidy et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2018 · 66 citations

Engineering, Electrical Engineering, Microfabrication +16

An O-band Metamaterial Converter Interfacing Standard Optical Fibers to Silicon Nanophotonic Waveguides

Tymon Barwicz, Alexander Janta-Polczynski, Marwan Khater et al. · Optical Fiber Communication Conference · 2015 · 63 citations

Engineering, Materials Engineering, Materials Science +17

Automated, high-throughput photonic packaging

Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira et al. · Optical Fiber Technology · 2018 · 58 citations · Full text

Engineering, Electrical Engineering, Manufacturing Engineering +17

Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips

Tymon Barwicz, Yoichi Taira, Hidetoshi Numata et al. · 2014 · 29 citations

Engineering, Electrical Engineering, Materials Science +15