Concepedia

Tong An

TA

Statistics

Publications

5

Citations

199

H-Index

5

Active since

2008

Affiliations

Beijing University of Technology(Current)

Tong An is an author at Beijing University of Technology specializing in engineering, mechanical engineering, and mechanics of materials.

Top concepts

EngineeringMicrostructureMaterial ScienceMechanical EngineeringMechanics Of MaterialsMechanical PropertiesSolid MechanicsStructural MaterialsCorrosionMechanical Behavior

Publications per year

2008–2015

5

Publications

5

Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates

Tong An, Fei Qin · Microelectronics Reliability · 2014 · 104 citations · Full text

Imc Layer, Engineering, Severe Plastic Deformation +20

Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

Fei Qin, Tong An, Na Chen · Journal of Applied Mechanics · 2009 · 44 citations

Engineering, Lead-based Solder, Mechanical Engineering +16

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin · Journal of Electronic Packaging · 2015 · 25 citations

Microcracking Behavior, Engineering, Imc Growth +18

Strain rate effect and Johnson-Cook models of lead-free solder alloys

Fei Qin, Tong An, Na Chen · 2008 · 15 citations

Materials Science, Engineering, Strain Rate Effect +15

Mechanical properties of intermetallic compounds in solder joints

Weixu Zhong, Fei Qin, Tong An et al. · 2010 · 11 citations

Materials Science, Imc Layer, Engineering +14

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