Ta‐Yeh Lin

Design of Dual-Band Millimeter-Wave Antenna-in-Package Using Flip-Chip Assembly

Ta‐Yeh Lin, Tsenchieh Chiu, Da‐Chiang Chang · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 28 citations

Engineering, Electrical Engineering, Antennas +16

Low Phase Noise and Low Power Consumption VCOs Using CMOS and IPD Technologies

Yuan‐Chia Hsu, Hwann‐Kaeo Chiou, Hsien‐Ku Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 26 citations

Engineering, Electrical Engineering, Low-power Design +16

CMOS wideband LNA design using integrated passive device

Hsien‐Ku Chen, Yuan‐Chia Hsu, Ta‐Yeh Lin et al. · 2009 · 21 citations

Engineering, Electrical Engineering, Analog Electronics +16

A compact 24–26 GHz IPD-based 4×4 Butler matrix for beam forming antenna systems

Ibrahim Haroun, Ta‐Yeh Lin, Da‐Chiang Chang et al. · 2012 · 17 citations

Engineering, Electrical Engineering, Antennas +16

Design of $V$ -Band Wide-Beamwidth Circularly Polarized Wire-Bond Antenna

Ta‐Yeh Lin, Tsenchieh Chiu, Da‐Chiang Chang · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 14 citations

Engineering, Electrical Engineering, Antennas +16