Concepedia

Ling Xu

LX

5

Publications

170

Citations

5

H-Index

2013

Active since

Affiliations

Huazhong University of Science and Technology(Current)

Wuhan University

Ling Xu is an author at Huazhong University of Science and Technology specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingMicroelectronicsElectrical EngineeringMaterial ScienceThermal EngineeringMechanical EngineeringHeat TransferThermodynamicsApplied Physics

Publications per year

2013–2016

5

Publications

5

Optimization for warpage and residual stress due to reflow process in IGBT modules based on pre-warped substrate

Yang Zhou, Ling Xu, Sheng Liu · Microelectronic Engineering · 2015 · 49 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +6

An optimal structural design to improve the reliability of Al2O3–DBC substrates under thermal cycling

Ling Xu, Miaocao Wang, Yang Zhou et al. · Microelectronics Reliability · 2015 · 49 citations

Materials Science, Al2o3–dbc Substrates, Material Analysis +9

Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance

Ling Xu, Yong Liu, Sheng Liu · Microelectronics Reliability · 2014 · 41 citations

Electrical Engineering, Power Electronic Modules, Engineering +13

Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module During Thermal Cycling Test

Ling Xu, Miaocao Wang, Yang Zhou et al. · 2016 · 18 citations

Wire Diameter, Engineering, Mechanical Engineering +21

DBC substrate in Si- and SiC-based power electronics modules: Design, fabrication and failure analysis

Ling Xu, Yang Zhou, Sheng Liu · 2013 · 13 citations

Engineering, Mechanical Engineering, Power Electronics +19

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