Concepedia

Fuwen Yu

FY

7

Publications

113

Citations

7

H-Index

2017

Active since

Affiliations

Harbin Institute of Technology(Current)

Shenzhen Institute of Information Technology

China Electronic Product Reliability and Environmental Test Institute

Fuwen Yu is an author at Harbin Institute of Technology specializing in electronic packaging, engineering, and materials science.

Top concepts

Publications per year

2017–2022

7

Publications

7

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Fuwen Yu, Bin Wang, Qiang Guo et al. · Advanced Engineering Materials · 2017 · 24 citations

, , +19

An interconnection method based on Sn-coated Ni core-shell powder preforms for high-temperature applications

Fuwen Yu, Chunjin Hang, Menghui Zhao et al. · Journal of Alloys and Compounds · 2018 · 19 citations

, , +10

A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging

Jiahao Liu, Fuwen Yu, Chunjin Hang et al. · Journal of Materials Science Materials in Electronics · 2019 · 19 citations

, , +8

Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices

Qiang Guo, Fuwen Yu, Hongtao Chen et al. · Journal of Materials Science Materials in Electronics · 2017 · 16 citations

, , +8

Rapid Formation of Full Intermetallic Bondlines for Die Attachment in High-Temperature Power Devices Based on Micro-sized Sn-Coated Ag Particles

Fuwen Yu, Hao Liu, Chunjin Hang et al. · JOM · 2019 · 14 citations

, , +10

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