Kwangjin Moon

Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration

Taeseong Kim, Sohye Cho, SeonKwan Hwang et al. · 2021 · 34 citations

Engineering, Cu Hybrid Bonding, Interconnect (Integrated Circuits) +18

Cu Microstructure of High Density Cu Hybrid Bonding Interconnection

Seokho Kim, Pilkyu Kang, Taeyeong Kim et al. · 2019 · 33 citations

Engineering, Cu Microstructure, Interconnect (Integrated Circuits) +18

Characteristics of Plasma-activated Dielectric Film Surfaces for Direct Wafer Bonding

Seongmin Son, Junhong Min, Eunsuk Jung et al. · 2020 · 25 citations

Engineering, Low-temperature Wafer Bonding, Plasma Processing +18

Annealing process and structural considerations in controlling extrusion-type defects Cu TSV

Jinho An, Kwangjin Moon, So‐Young Lee et al. · 2012 · 13 citations

Engineering, Mechanical Engineering, Large Volume +19