J.Y. Wu

Full intermetallic joints for chip stacking by using thermal gradient bonding

Ting Yang, Takumi Aoki, K. Matsumoto et al. · Acta Materialia · 2016 · 98 citations

Materials Engineering, Materials Science, 3D Ic Architecture +13

Low temperature bonding for high temperature applications by using SnBi solders

Tsung‐Lin Yang, J.Y. Wu, C.C. Li et al. · Journal of Alloys and Compounds · 2015 · 54 citations

Materials Science, Materials Engineering, Engineering +12

Study of an innovative one-sided actuating piezoelectric valveless micropump with a secondary chamber

Hang Su, J.Y. Wu · Sensors and Actuators A Physical · 2011 · 34 citations

Engineering, Microfabrication, Piezoelectric Valveless Micropump +8

Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints

Tilo H. Yang, J.Y. Wu, Z. X. Zhu et al. · Materials Chemistry and Physics · 2017 · 25 citations

Materials Science, Engineering, Micromechanics +11

Numerical investigation of topical drug transport in the anterior human eye

Han Chen, Feng Zhang, Yukan Huang et al. · International Journal of Heat and Mass Transfer · 2015 · 23 citations

Ophthalmology, Medicine, Anterior Human Eye +8