Zongxiang Yao

Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling

Long Zhang, Dengjie Xiong, Zilong Su et al. · Materials Today Communications · 2022 · 79 citations

Materials Science, Materials Engineering, Engineering +10

Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints

Limeng Yin, Zhongwen Zhang, Zilong Su et al. · Materials Science and Engineering A · 2021 · 37 citations

Materials Engineering, Interfacial Microstructure Evolution, Materials Science +4

Double-Sided Single-Pass Submerged Arc Welding for 2205 Duplex Stainless Steel

Jian Luo, Yi Yuan, Xiaoming Wang et al. · Journal of Materials Engineering and Performance · 2013 · 36 citations

Duplex Stainless Steel, Friction Welding, Welding Process +1

Transformation of Laves phases and its effect on the mechanical properties of TIG welded Mg-Al-Ca-Mn alloys

Sensen Chai, Shiyu Zhong, Qingshan Yang et al. · Journal of Material Science and Technology · 2022 · 22 citations

Materials Science, Laves Phases, Engineering +9

Oxidation behavior and intermetallic compound growth dynamics of SAC305/Cu solder joints under rapid thermal shock

Ming Wu, Shanlin Wang, Limeng Yin et al. · Transactions of Nonferrous Metals Society of China · 2023 · 22 citations · Full text

Materials Engineering, Materials Science, High Temperature Materials +14