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Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling

Materials ScienceMaterials EngineeringEngineeringNanomaterialsApplied PhysicsMetallurgical InteractionNanoscale ModelingTin GrowthMolecular Dynamics SimulationThermo-mechanical-electrical CouplingInterfacial StudyInterface PropertyMicrostructure