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Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints

DOI

37

Citations

33

References

2021

Year

Limeng Yin, Zhongwen Zhang, Zilong Su, Hehe Zhang, Cunguo Zuo, Zongxiang Yao, Gang Wang, Long Zhang, Yupeng Zhang
Materials Science and Engineering A

References

YearCitations

Page 1