Concepedia

Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints

Limeng Yin, Zhongwen Zhang, Zilong Su, Hehe Zhang, Cunguo Zuo, Zongxiang Yao, Gang Wang, Long Zhang, Yupeng Zhang

Materials Science and Engineering A · 2021 · 39 citations · 33 references

DOI

Concepts

References

33

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Mingyue Xiong, Liang Zhang · Journal of Materials Science · 2018 · 208 citations

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Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

Fengjiang Wang, Hong Chen, Ying Huang et al. · Journal of Materials Science Materials in Electronics · 2019 · 207 citations

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Recent advances in nano-materials for packaging of electronic devices

Shuye Zhang, Xiangyu Xu, Tiesong Lin et al. · Journal of Materials Science Materials in Electronics · 2019 · 147 citations

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The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump

Guh-Yaw Jang, Jyh‐Wei Lee, Jeng‐Gong Duh · Journal of Electronic Materials · 2004 · 129 citations

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Energy Principle of Elastic‐Plastic Fracture and Its Application to the Fracture Mechanics of a Polycrystalline Graphite

Mototsugu Sakai, Kazuhiro Urashima, Michio Inagaki · Journal of the American Ceramic Society · 1983 · 122 citations

, , +17