Jong‐Hoon Chun

A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications

Sung–Ku Yeo, Jong‐Hoon Chun, Young‐Se Kwon · IEEE Transactions on Advanced Packaging · 2010 · 61 citations

Radar, Advanced Packaging, Electrical Engineering +15

A 28-GHz Four-Channel Beamforming Front-End IC With Dual-Vector Variable Gain Phase Shifters for 64-Element Phased Array Antenna Module

Jinseok Park, Seungchan Lee, Jong‐Hoon Chun et al. · IEEE Journal of Solid-State Circuits · 2022 · 49 citations

Chip Size, Millimeter Wave Technology, Engineering +7

A four-channel bi-directional CMOS core chip for X-band phased array T/R modules

Sanghoon Sim, Byungjoo Kang, Jeong‐Geun Kim et al. · 2015 · 15 citations

Electrical Engineering, Chip Size, Engineering +11

Quasi-Coaxial Vertical via Transitions for 3-D Packages Using Anodized Aluminum Substrates

Sung–Ku Yeo, Kyoung-Min Kim, Jong‐Hoon Chun et al. · IEEE Microwave and Wireless Components Letters · 2009 · 10 citations

Engineering, 3-D Packages, Quasi-coaxial Vertical +20