Statistics
Publications
15
Citations
359
H-Index
11
Active since
1993
Kwangho Kim is an author at Sungkyunkwan University specializing in engineering, electrical engineering, and power electronics.
Publications per year
1993–2023
15
15
Application of through mold via (TMV) as PoP base package
Jinseong Kim, Kiwook Lee, Dongjoo Park et al. · 2008 · 54 citations
1–5 of 15