Statistics
Publications
13
Citations
328
H-Index
11
Active since
1993
Kwangho Kim is an author at Sungkyunkwan University specializing in engineering, electrical engineering, and computer engineering.
Publications per year
1993–2022
13
13
Application of through mold via (TMV) as PoP base package
Jinseong Kim, Kiwook Lee, Dongjoo Park et al. · 2008 · 53 citations
Jawad Yousaf, Hojin Jung, Kwangho Kim et al. · Journal of electromagnetic engineering and science · 2016 · 26 citations · Full text
Electrical Engineering, Performance Enhancement, Engineering +12
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