Statistics
Publications
12
Citations
378
H-Index
11
Active since
2015
Qian Bai is an author at Dalian University of Technology specializing in engineering, materials engineering, and materials science.
Publications per year
2015–2024
12
12
Formation of subsurface cracks in silicon wafers by grinding
Jingfei Yin, Qian Bai, Yinnan Li et al. · Nanotechnology and Precision Engineering · 2018 · 36 citations · Full text
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